SpeedEdge™ Edge-Card and Mezzanine Connector System

Image of Molex logo

SpeedEdge™ Edge-Card and Mezzanine Connector System

Molex's edge-card connector system is mechanically robust with thicker walls and higher stack height

Molex's SpeedEdge edge-card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. Mechanically robust with thicker walls and higher stack height when compared to SpeedStack™ connectors and other mezzanine systems and securely holds thick PCBs, delivers durability and high mating cycles. The design includes contacts with a gradual lead-in, lessening the risk of contact stubbing and supporting high-mating cycles. The SpeedEdge accommodates PCBs with blunt chamfers. The low profile (as low as 7.00 mm) provides real estate savings in space-constrained applications. It offers 92 Ω impedance. They are avaliable in multiple circuits sizes of 60 circuits to 82 circuits with ranges in various differential pairs.

Applications
  • Telecommunication
    • Remote radio antennas
    • Base stations
    • Mobile
  • Networking
    • Servers
    • Routers
    • Switches
    • Storage
  • Military and Medical
    • Scanning equipment
  • Consumer
    • Cameras
    • Handheld scanners
  • Automotive
    • Front camera modules
    • Infotainment units
Electrical
  • Voltage (max.): 250 VAC
  • Current (max.): 1.0 A per pin
  • Contact resistance: 20 mΩ
  • Dielectric withstanding voltage: 300 VAC
  • Insulation resistance: 10 MΩ

Email: Info@ariat.hkHK TEL: +00 852-30501900ADD: Rm 2703 27F Ho King Comm Center 2-16,
Fa Yuen St MongKok Kowloon Hong Kong.