Molex's SpeedEdge edge-card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. Mechanically robust with thicker walls and higher stack height when compared to SpeedStack™ connectors and other mezzanine systems and securely holds thick PCBs, delivers durability and high mating cycles. The design includes contacts with a gradual lead-in, lessening the risk of contact stubbing and supporting high-mating cycles. The SpeedEdge accommodates PCBs with blunt chamfers. The low profile (as low as 7.00 mm) provides real estate savings in space-constrained applications. It offers 92 Ω impedance. They are avaliable in multiple circuits sizes of 60 circuits to 82 circuits with ranges in various differential pairs.
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